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ET5429 Composite Bonding Grade Two-Part Epoxy, Charcoal black
Permabond® ET5429 is a thixotropic two-part adhesive with excellent resistance to impact and vibration. The controlled flow properties as well as its ease of mixing and application, enable the adhesive to be used where gap filling or vertical application is required. Permabond® ET5429 has been found to provide exceptional performance even at elevated temperatures. It is ideal for use in the construction of composite assemblies.
- Ideal for bonding composite materials
- Easy to apply
- High shear and peel strength
- Good impact strength
- High-temperature resistance
- Static Mixer included with each Cartridge
PAC Item Code | C100404 |
---|---|
Brand | Permabond |
Type | Two-Part Epoxy |
Physical Properties of Uncured Adhesive
ET5429A | ET5429B | |
---|---|---|
Chemical Composition | Epoxy Resin | Polyamine Hardener |
Appearance | White | Black |
Mixed Appearance | Charcoal black | |
Viscosity @25°C | 20rpm: 200,000 mPa.s (cP) 2rpm: 300,000 mPa.s (cP) |
20rpm: 60,000 mPa.s (cP) 2rpm: 150,000 mPa.s (cP) |
Specific Gravity | 1.0 | 1.0 |
Typical Curing Properties
- Mix ratio: 2:1 by volume, 2:1 by weight
- Maximum gap fill: 5mm (0.2")
- Usable / pot life @23°C 10g: 2-4 hours
- Handling time @23°C: 6-10 hours
- Working strength:
- 23°C: 24 hours
- 60°C: 1 hour
- Full cure:
- 23°C: 72 hours
- 60°C: 2 hour
Typical Performance of Cured Adhesive
- Shear strength* (ISO4587)
- Mild Steel: 23-28 N/mm2 (3335-4060psi)
- Aluminium: 26-31 N/mm2 (3770-4495psi)
- Stainless Steel: 25-30 N/mm2 (3625-4350psi)
- Carbon Fibre: >25 N/mm2 ** SF (>3625psi)
- FRP Glass/Polyester: >6 N/mm2** SF (>870psi)
- FRP Glass/Epoxy: 18-22 N/mm2 (2610-3190psi)
- PEEK: 4-5 N/mm2 (580-725psi)
- PA6 30% filled: 4-6 N/mm2 (580-870psi)
- PVC: >3 N/mm2 ** SF (>435psi)
- Polycarbonate: 3-4 N/mm2 (435-580psi)
- Peel strength (aluminum) (ISO4578): 150-230 N/25mm (33-51 PIW)
- Impact strength (ASTM D-950): 30-40 KJ/m2
- Hardness (ISO868): 65-75 Shore D
- Elongation at break (ISO37): <5%
- Glass transition temperature Tg: 50-60°C (122-140°F)
- Dielectric strength: 15-25 kV/mm
*Strength results will vary depending on the level of surface preparation and gap.
**SF Denotes substrate failure