Component Shipping & Handling

ESDS items, system or packaging marking shall be in accordance with customer contracts, purchase orders, drawing or other documentation. When the contract, purchase order, drawing or other documentation does not define ESDS items, system or packaging marking, the Organization, in developing the ESD Control Program Plan, shall consider the need for marking. If it is determined that marking is required, it shall be documented as part of the ESD Control Program Plan. ESD damage can occur in a number of ways, including:

• A charged object (including a person) coming into contact with an ESDS item.
• A charged ESDS device making contact with a ground or another conductive object at a different potential.
• An ESDS device is grounded while exposed to an electrostatic field.

Examples of ESDS items include microcircuits, discrete semiconductors, thick and thin film resistors, hybrid devices, printed circuit boards and piezoelectric crystals. It is possible to determine device and item susceptibility by exposing the device to simulated ESD events. The level of sensitivity, determined by testing using simulated ESD events, may not necessarily relate to the level of sensitivity in a real-to-life situation. However, the levels of sensitivity are used to establish a baseline of susceptibility data for comparison of devices with equivalent part numbers from different manufacturers. Two different models are used for characterization of electronic components: HBM and CDM. Compliance with this standard can be demonstrated through third party certification. The certification process is similar to any quality management system certification such as ISO 9001. Learn More.