About AIM Solder
AIM is a leading global manufacturer of solder assembly materials for the electronics industry with manufacturing, distribution, and support facilities located throughout the globe. AIM serves the electronics industry, as well as various specialized businesses, including LED lighting, mobile devices, automotive, renewable energy and aerospace. AIM is committed to developing world class products through innovative R&D and offering unparalleled sales and technical support.
Why Buy From Us?
Production Automation Corporation is a factory-direct AIM soldering distributor. When seeking AIM solder bar, flux, or solder bar for sensitive applications, lean on our specialists for end-to-end service and purchase support. We support industries including general manufacturing, electronics, soldering, and static control.
Discounts Available
Ask about local delivery, bulk discounts on repeat purchases, and same-day replenishment from a warehouse near you. Call now, or contact one of our regional sales specialists.
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Bar Solder
AIM Electropure™ Bar Solder Alloys are processed from virgin metals in a proprietary method that removes contaminants and reduces dissolved oxides to a minimum. The result of this is an extremely pure, low drossing solder bar that increases throughput and decreases defects.
Wire Solder
AIM Solid and Cored Wire Solders are available in a variety of alloys, diameters, flux core percentages and spool sizes designed to suit all soldering applications. AIM cored wire solders are produced in a proprietary method that guarantees a void-free flux core. These cored wires are available in no clean, water soluble and rosin based chemistries.
Solder Paste
AIM Solder Pastes are available in a variety of alloys, particle sizes, metal contents and viscosities designed to suit all SMT applications. AIM solder pastes are produced from the highest quality, oxide-free powder manufactured to the Electropure™ specification. Solder pastes are manufactured in no clean, water soluble and rosin based chemistries.
Flux & Flux Thinner
AIM Liquid Fluxes and Paste Fluxes are available in a variety of formulations and packaging. The no clean, water soluble and rosin based chemistries of AIM fluxes offer a broad range of benefits proven to perform well in a variety of applications.
Additional AIM Solder Materials
AIM offers a variety of Epoxies, Underfills, Chemicals and Cleaners that are fully compatible with our many solder pastes, epoxies, fluxes and cored wires. Formulated for application by hand or automated dispensing equipment, these products are available in industry standard packaging.
AIM Solder Alloys
Zero defect wave soldering requires consistent solder quality. Contaminants and high oxide levels in bar solder can result in wave soldering defects such as bridging, icicling, and non-wetting. In order to avoid these problems, users of bar solder are encouraged to utilize AIM's high-purity and low drossing bar solder alloys, which are made to some of the most stringent specifications in the industry. AIM Solder provides high-quality solder alloys to the electronics industry.
AIM Electropure™ Bar Solder Alloys are processed from virgin metals in a proprietary method that removes contaminants and reduces dissolved oxides to a minimum. The result of this is an extremely pure, low drossing solder bar that increases throughput and decreases defects.
REL61™ and REL22™ lead-free solder alloys have been developed to meet the demands of an evolving solder market. Greater durability, lower costs and lower processing temperature are key drivers, and AIM REL61 and REL22 provide assemblers with new tools to improve product quality in the assembly process. REL alloys have demonstrated reduced tin whisker formation as well as outperforming SAC alloys in thermal shock, vibration and drop shock resistance, making these alloys the ideal choice for all electronics applications. Available in bar solder, wire solder, solder paste.
SN100C is a lead-free solder alloy, developed by Nihon Superior, that is comprised of tin-copper-nickel + germanium. The properties of SN100C offer an advantage in terms of performance and cost compared to other lead-free alloys. From automotive and aerospace to consumer and telecom, SN100C has a proven history of providing a reliable, cost-effective lead-free alloy solution.
SAC305 is a lead-free alloy that contains 96.5% tin, 3% silver, and 0.5% copper. This alloy falls under the JEIDA recommendation for lead-free soldering. When used in wave soldering, AIM SAC305 bar solder offers far superior fluidity as compared to other alloys and makes of bar, resulting in excellent flow. AIM SAC305 bar solder also produces less dross than other bar solder, wets well, provides superior joint strength, and offers superior copper dissolution rates. AIM SAC305 bar solder is alloyed in the proprietary Electropure™ method that results in a low drossing, high wetting solder. The Electropure process reduces suspended oxides in the solder, thus reducing drossing, improving flow and reducing bridging during soldering. SAC305 may be used with most existing equipment, processes, coatings, and flux chemistries.
Sn63/Pb37 Electropure™ is a high purity alloy that is composed of 63% tin and 37% lead. Electropure is alloyed in a proprietary method that results in a low drossing, high wetting solder. The Electropure process reduces suspended oxides in the solder, thus reducing drossing, improving flow, and reducing bridging during soldering. Sn63/Pb37 is a eutectic alloy with a melting point of 183°C (361°F). Typical applications are wave soldering and plating where Sn63/Pb37 is primarily used as a coating for corrosion protection, and as a base for soldering. This alloy is available in bar, solid and cored wire, foil, spheres, preforms, powder, solder paste, ingot, and anode form.
Dross Services
AIM is a full-service recycler that offers accurate analysis with the highest possible yield from your solder scrap. Customers will benefit from the greatest recovery value for their material with the added assurance of environmentally safe processing. Contact your sales representative for more information about this service.
Technical Articles from AIM Solder
Would you believe QFN ground pad voids could be cut by over 50% with a zero-cost, super-simple stencil aperture modification? Learn more.
If the issue is electrochemical contamination, corrosion, or leakage-related, the first place to look is the rework bench. Learn more.
From the shipping truck to the production floor, control of the environment that paste is exposed to is critical. Humidity is especially concerning to paste as it may lead to SMT defects such as slumping or solder balling. Download.
Is SMT Ready for Low-Temperature Solders?With no standard in sight, emerging alloys require unique fluxes and processes. Download.
Life After SAC305With RoHS exemptions set to expire, can SAC305 hang on? Download.
Solder Alloy FragmentationWith RoHS exemptions set to expire, the SMT market might see a host of new solders. Download.
Void Reduction on QFNsSometimes the answers to the most tenacious questions are right under your nose. Download.
Pretty SlickSTENCILS: Coated vs. Uncoated... what’s better for the process? Download.
The Impact of Reduced Alloy Powder SizeAIM evaluated the benefits and implications of finer mesh solder powder on critical aspects of solder paste performance. Download.
The Bigger the Blob, the Easier the JobStencil printing is efficient and effective, but it is not without its limitations. Download.
Squaring the CircleThe term “squircle” is a mashup of square and circle. Besides having a funny name, the squircle is an effective tool for maximizing solder paste release and overall deposit volume. Download.
Go with the FlowPaste viscosity can inform why solder performs differently under different conditions. Download.
Unforgiving EnvironmentsProper handling and storage controls go a long way toward print quality. Download.
The Balancing ActIn Search of the Perfect Solder Paste. Hint, it's a moving target. Download.
Comparing Alternative Lead-Free AlloysComparing Properties of CASTIN™, BABBITT, and Alternative Lead-Free Alloys. Download.
Solder Paste Powder: When to DownsizeA finer type solder paste may solve one problem only to create another. Download.
Flux-Crazed Solder MaskTo err is human; to blame the other vendor is… policy. Download.
Troubleshooting Chip Component Solder BallsA Tale of Fresh Eyes, Red Herrings and Dirty Tweezers… Download.
Minimizing BTC VoidsAnd why waiting until the last process step is a bad idea. Download.
More Technical Articles from AIM >