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ET514 Toughened Flow Controlled Two-Part Epoxy, White/Black
Permabond® ET514 is a 1:1 mixable epoxy adhesive. It has excellent resistance to impact and vibration and is ideal for structural bonding of metal, wood, composites, and certain plastics. Its rapid cure speed coupled with its structural strength makes this adhesive suitable for a wide variety of applications. ET514 is high strength and has excellent environmental durability.
- Adhesion to a wide variety of substrates
- Full cure at room temperature
- Easy to apply
- High shear and peel strength
- Good impact strength
*Static mixer included with 400mL Cartridge
PAC Item Code | C100398 |
---|---|
Brand | Permabond |
Type | Two-Part Epoxy |
Physical Properties of Uncured Adhesive
ET514A | ET514B | |
---|---|---|
Chemical Composition | Epoxy Resin | Polyamine Hardener |
Appearance | White | Black |
Viscosity @25°C | 20rpm: 65,000 mPa.s (cP) 2rpm: 225,000 mPa.s (cP) |
20rpm: 65,000 mPa.s (cP) 2rpm: 150,000 mPa.s (cP) |
Specific Gravity | 1.1 | 1.2 |
Typical Curing Properties
- Mix ratio by volume: 1:1
- Maximum gap fill: 2mm (0.08")
- Usable / pot life @23°C: 30-50 mins
- Handling time @23°C: 60-120 mins
- Working strength @23°C: 8-12 hours
- Full cure @23°C: 24 hours
Typical Performance of Cured Adhesive
- Shear strength* (ISO4587)
- Mild steel: 20-30 N/mm2 (2900-4350psi)
- Aluminium: 12-16 N/mm2 (1740-2320psi)
- Stainless Steel: 18-22 N/mm2 (2610-3190psi)
- Carbon Fibre: 17-21 N/mm2 (2465-3045psi)
- FRP Glass/Polyester: >12 N/mm2** SF (>1740psi)
- FRP Glass/Epoxy: 17-21 N/mm2 (2465-3045psi)
- PEEK: 3-4 N/mm2 (435-580psi)
- Polycarbonate: >8 N/mm2** SF (>1160psi)
- PA6 30% filled: 6-7 N/mm2 (870-1015psi)
- PA6 unfilled: 3-4 N/mm2 (435-580psi)
- Peel strength (aluminum) (ISO11339): 100-150 N/25mm (23-34 PIW)
- Hardness (ISO868): 60-75 Shore D
- Elongation at break (ISO37): 10-15%
- Glass transition temperature Tg: 40-50°C (104-122°F)
- Dielectric strength: 15-25 kV/mm
- Thermal conductivity: 0.3 W/(m.K)
*Strength results will vary depending on the level of surface preparation and gap.
*SF Denotes substrate failure