825 High-Temperature Fast Curing Cyanoacrylate Adhesive, Clear
Permabond® 825 is a low-viscosity modified ethyl cyanoacrylate suitable for applications where high-temperature resistance is required. This material is fast-setting and has good adhesion to rubber, metal, and plastics. Permabond® 825 has excellent retention of strength during thermal aging. Cyanoacrylate adhesives are single-component adhesives that polymerize rapidly when pressed into a thin film between parts. The moisture adsorbed on the surface initiates the curing of the adhesive. Strong bonds are developed extremely fast and on a great variety of materials. These properties make Permabond® cyanoacrylates the ideal adhesives for high-speed production lines.
- High-temperature resistance
- Rapid curing
- Ease of use - no mixing or heat cure
- 100% reactive, no solvents
- Excellent thermal aging
| PAC Item Code | C100384 |
|---|---|
| Brand | Permabond |
| Type | Cyanoacrylate |
Physical Properties of Uncured Adhesive
- Chemical composition: Ethyl cyanoacrylate
- Appearance: Colourless
- Viscosity @ 25°C: 100-150 mPa.s (cP)
Typical Curing Properties
- Maximum gap fill: 0.15mm (0.006")
- Fixture/handling time* (0.3 N/mm2 shear strength is achieved)
- 10-20 seconds (Steel)
- 5-10 seconds (NBR)
- 10-15 seconds (Buna N Rubber)
- 5-10 seconds (Phenolic)
- 10-20 seconds (HDPE)
- 40-60 seconds (LDPE)
- Full strength 24 hours
*Handling times can be affected by temperature, humidity, and specific surfaces being bonded. Larger gaps or acidic surfaces will also reduce cure speed but this can be overcome by the use of Permabond C Surface Activator (CSA) or Permabond QFS 16.
Typical Performance of Cured Adhesive
- Shear strength* (ISO4587):
- Mild Steel 15-20 N/mm2 (2175-2900 psi)
- Stainless Steel 18-22 N/mm2 (2610-3190 psi)
- Aluminium 12-16 N/mm2 (1740-2320 psi)
- Acrylic >6 N/mm2 (>870 psi) SF**
- Polycarbonate >5 N/mm2 (>725 psi) SF**
- ABS >6 N/mm2 (>870 psi) SF**
- PVC >5 N/mm2 (>725 psi) SF**
*Strength results will vary depending on the level of surface preparation and gap.
**SF = Substrate failure
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