Permabond

2010 Thixotropic Gel Cyanoacrylate Adhesive, Clear

In Stock

Permabond® 2010 is a thixotropic, fast-setting cyanoacrylate particularly suitable for use on vertical and porous substrates. This material can be used on metals, plastics, elastomers, ceramics, and wood. Cyanoacrylate adhesives are single-component adhesives that polymerize rapidly when pressed into a thin film between parts. The moisture adsorbed on the surface initiates the curing of the adhesive. Strong bonds are developed extremely fast and on a great variety of materials. These properties make Permabond cyanoacrylates ideal adhesives for high-speed production lines.

  • Thixotropic dispensable semi-gel
  • Fast cure
  • Easy to apply and dispense
  • 100% reactive, no solvents
  • Maximum gap-filling capability
As low as $30.55

Technical Documents

Product Info & TDS Sheets
More Information
PAC Item Code C100393
Brand Permabond
Type Cyanoacrylate

Physical Properties of Uncured Adhesive

  • Chemical composition: Ethyl cyanoacrylate
  • Appearance: Colourless
  • Viscosity @ 25°C:
    • 20rpm: 2,000-2,500 mPa.s (cP)
    • 2rpm: 10,000-20,000 mPa.s (cP)
  • Specific gravity: 1.1

Typical Curing Properties

  • Maximum gap fill: 0.5mm (0.02")
  • Fixture/handling time* (0.3 N/mm2 shear strength is achieved)
    • 10-15 seconds (Steel)
    • 10-15 seconds (Buna N Rubber)
    • 10-15 seconds (Phenolic)
  • Full strength 24 hours

*Handling times can be affected by temperature, humidity, and specific surfaces being bonded. Larger gaps or acidic surfaces will also reduce cure speed but this can be overcome by the use of Permabond C Surface Activator (CSA) or Permabond QFS 16.

Typical Performance of Cured Adhesive

  • Shear strength* (ISO4587):
    • Steel 19-23 N/mm2 (2800-3300 psi)
    • Aluminium 7-9 N/mm2 (1000-1300 psi)
    • Zinc 10 N/mm2 (1500 psi)
    • ABS >6 N/mm2 (900 psi) SF**
    • PVC >6 N/mm2 (900 psi) SF**
    • PC >5 N/mm2 (700 psi) SF**
    • Phenolic 14N/mm2 (2000 psi)
  • Impact strength (ASTM D-950): 3-5 kJ/m2 (1.4-2.4 ft-lb/in2)
  • Dielectric Strength (DIN 53481): 25 kV/mm
  • Dielectric Constant @ 1MHz (DIN 53483): 3
  • Coefficient of thermal expansion: 90 x 10-6mm/mm/°C
  • Coefficient of thermal conductivity: 0.1 W/(m.K)
  • Hardness (ISO868): 85 Shore D

*Strength results will vary depending on the level of surface preparation and gap.
**SF = Substrate failure

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