ST 300 120V Convective Hot Air Reflow System

The ST 300 Convective Hot Air Reflow System is an analog, self-contained system for the manual installation and removal of SMD's. The unit offers a non-contact heating method for the manual installation and removal of virtually any standard surface mount component including BGAs, QFNs, SOICs and many other SMDs. The system uses a pump to generate airflow that first passes through a heater, where it is warmed to the appropriate temperature, and then through a nozzle that "shapes" the air stream for the specific component. Easy-to-read dials allow adjustment of air temperature and flow rate. The ST 300 features a Quiet-Flo turbine blower for close to silent operation and immediately turns off air flow after use - the unit does not require a "cool-down" period where hot air blows through the handpiece, as competitive units do. The heavy-duty, durable metal housing ensures years of service.

The ST 300's powerful handpiece features an integrated, spring loaded vacuum pick with interchangeable vacuum cup sizes for holding and lifting components. The "give" in the spring loading is set, but the absolute position of the vacuum pik is adjustable over a 1.5" length. Both cycle start and vacuum functions are activated with conveniently located switches on the handpiece. And unlike competitive handpieces, the unique nozzle adaptor does not require tools, allowing for instantaneous change-out of heat focusing nozzles.

Nozzles sold separately.

• Compatible with PACE Rework Nozzles