Kester R560

Sn63/Pb37 Water Soluble Solder Paste

Reduces BGA voiding to under 5%
8 hour stencil life
Consistent printing over a range of temperatures and humidity levels
Wets excellently to AgPb leaded components
Reduces scrap due to less paste dry out
Residues easily removed with Hot DI water
Classified as ORH0 per J-STD-004
Compatible with enclosed printing systems
Shelf life 6 month from DOM, when handled properly.
Non-stocked Kester items may be subject to minimum orders.

Grouped product items
Product Name	Qty
Kester 70-2002-0510 Sn63/Pb37 Water Soluble 90.0% T3 Solder Paste, 500g Jar (Box of 10) $1,401.63
Kester 70-2002-0511 Sn63/Pb37 Water Soluble 90.0% T3 Solder Paste, 600g Cartridge (Box of 10) $1,682.96

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Technical Documents

Warranty

Kester Product Warranty

Product Info & TDS Sheets

Kester R560 Solder Paste Data Sheet

SDS/MSDS Sheets

Kester R560 Solder Paste Safety Data Sheet (SDS)

Details

Kester R560 is an organic acid, water-soluble solder paste formula specifically designed to reduce voiding in Ball Grid Array (BGA) solder connections. The voiding in BGA's has been shown to be reduced from 25% to less than 5%. R560 is also resistant to extremes in temperature and relative humidity. R560 is designed to be slump resistant in high humidity conditions. The solder paste exhibits long stencil life and tack time, while still delivering exceptional solderability to a wide variety of metallic substrates. The activator package in this formula is very aggressive, providing superior wetting to OSP coated boards and Ag/Pd leaded components.

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