CU11-3127 Underfill Epoxy, 50cc EFD Syringe, 70g
Key Features
- Low moisture absorption
- Releases stress over a large area, primary stress is CTE mismatch between component and board
- High Glass Transition Temperature (Tg)
- Low Coefficient of Thermal Expansion
- Halogen-free
- Complies with RoHS Directive 2011/65/EU
ALPHA HiTech CU11-3127, a product with high filler content, is available to provide better mechanical strength for CSP and Flip Chip packages. ALPHA HiTech CU11-3127 provides full bottom component coverage at room temperature.
A higher preheat temperature up < 80° C may be applied to the substrate for a faster underfill flow rate.
| SKU | I345185 |
|---|---|
| Mfg. Part Number | 259033.0070GME |
| Brand | ALPHA HiTech |
| Type | Underfill |
| Size | 50cc |
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