Indium NC-SMQ92J

Sn63/Pb37 Halogen-Free No-Clean Solder Paste

NC-SMQ92J is a halogen-free, air reflow, no-clean solder paste formulated to leave a benign, probe-testable residue. The residue is easily penetrated and will not clog multi-point probes. This product has other qualities such as consistent fine-pitch paste deposition, unsurpassed stencil life and tack time, and excellent wetting. NC-SMQ92J will perform well on high-speed surface mount lines utilizing fast print speeds and rapid chip placement. NC-SMQ92J meets or surpasses all ANSI/J-STD-004, -005 specifications, and Bellcore test criteria.

Excellent wetting reflow in air
Probe-testable residue
Extended open time
Consistent fine-pitch printing
Strong initial tack strength and long-term stability
High humidity resistance
Halogen-free

Grouped product items
Product Name	Qty
Indium 82453-500G Sn63/Pb37 Halogen-Free No-Clean 89.5% T4 Solder Paste, 500g Jar $101.11
Indium 82453-700G Sn63/Pb37 Halogen-Free No-Clean 89.5% T4 Solder Paste, 700g Cartridge In Stock $141.55
Indium 82320-500G Sn63/Pb37 Halogen-Free No-Clean 90% T3 Solder Paste, 500g Jar $96.21
Indium 82320-700G Sn63/Pb37 Halogen-Free No-Clean 90% T3 Solder Paste, 700g Cartridge $134.69

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Technical Documents

Product Info & TDS Sheets

Indium NC-SMQ®92J Solder Paste Technical Data Sheet

Details

Features

Type: Sn63/Pb37 NC-SMQ92J No-Clean Halogen-free Solder Paste Type 4 Metal Load: 89.50% (82453)
Type: Sn63/Pb37 NC-SMQ92H No-Clean Halogen-free Solder Paste Type 3 Metal Load: 90.00% (82320)
Shelf Life: 6 months
Alloy: Sn63/Pb37 TYPE: No-Clean
Storage Conditions: < 10°C (unopened containers)
J-Standard-005, Flux Classification: ROL0, J-Standard-004, BELLCORE GR-78
Superior stencil life
Compatible Products:
- Rework Flux: PoP Flux 8.9HF-LV, TACFlux®020
- Cored Wire: CW-807
- Wave Flux: WF-9945, WF-9955, FP-500, NC-771

Alloys

Indium Corporation manufactures low-oxide spherical powder composed of SnPb and SnPbAg in the industry standard Type 3 mesh size. Other non-standard mesh sizes are available upon request. The weight ratio of the flux/vehicle to the solder powder is referred to as the metal load and is typically in the range of 85-92% for standard alloy compositions.

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