Indium 10.8HF

Durafuse® LT Lead-Free, Halogen-Free No-Clean Solder Paste

Lead-Free

Durafuse® LT is a patented novel solder paste mixed-alloy system for low-temperature reflow processes which require high drop shock reliability. Durafuse® LT is made up of a low-melting in-containing alloy and higher-melting SAC alloy. The SnInAg alloy initiates joint fusion while the SAC alloy provides enhanced strength and durability. Durafuse® LT is ideal for high-reliability applications, which utilize thermally sensitive components.

Grouped product items
Product Name	Qty
Indium PASTEIN-802055-500G Durafuse® LT Lead-Free, Halogen-Free No-Clean 88.5% T4 Solder Paste, 500g Jar $430.14
Indium PASTEIN-802055-600G Durafuse® LT Lead-Free, Halogen-Free No-Clean 88.5% T4 Solder Paste, 600g Cartridge $516.16

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Technical Documents

Product Info & TDS Sheets

Indium 10.8HF Durafuse® LT Solder Paste Technical Data Sheet

Details

Features

Excellent drop shock reliability-comparable to SAC
Reflow below 210°C
Melting temperature above 180°C
Good mechanical shear strength up to 150-165°C
Good thermal and electrical conductivity
Storage Conditions (unopened containers): <10°C
Shelf Life: 6 months
Compatible Products
- Rework Flux: TACFlux® 089HF, TACFlux® 020B-RC
- Liquid Rework Flux: FP-500

Flux Vehicle

Indium10.8HF is a halogen-free, no-clean solder paste. This paste has excellent wetting properties on all fresh and aged surface finishes including, but not limited to, OSP, ImAg, ImSn, and ENIG. Indium10.8HF features exceptional HIP and NWO performance. This paste has a wide reflow profile window under both air and nitrogen, enabling a fully optimized reflow process. Indium10.8HF is not designed for standard low-temperature reflow profiles, but may be used for select processes with Durafuse® LT.

Key Applications

Low-temperature solders reduce warpage of thermally sensitive components by reducing peak reflow temperature; however, standard Bi-based low-temperature alloys are unable to withstand even moderate drop shock. Durafuse® LT is a low-temperature Pb-free solder capable of reducing peak reflow temperature by 40°C relative to SAC305, with drop shock reliability two orders of magnitude greater than standard low-temperature alloys.

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