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SAC305 Lead-Free No-Clean Solder Paste
Indium8.9E is an air reflow, no-clean solder paste specifically formulated to accommodate the higher processing temperatures required by the SnAgCu, SnAg, and other alloy systems favored by the electronics industry to replace conventional Pb-bearing solders. Indium8.9E offers unprecedented stencil print transfer efficiency to work in the broadest range of processes. In addition, the high oxidation resistance of Indium8.9E virtually eliminates incomplete coalescence (graping) of small deposits.
- High transfer efficiency through small apertures (≤0.66AR)
- Eliminates graping phenomenon on small deposits
- Low-voiding in BGA/CSP solder joints
Features
- Type: Lead-Free 8.9E No-Clean Solder Paste Type 3 Metal Load: 88.75% (800514)
- Type: Lead-Free 8.9E No-Clean Solder Paste Type 4 Metal Load: 88.50% (800515)
- Shelf Life: 6 months
- Alloy: SAC305 (Sn96.5Ag3Cu0.5) Type: No-Clean
- Storage Conditions: <10°C (unopened containers)
- Flux Type (per J-STD-004A), ROL1, J-STD-005 (IPC-TM-650), BELLCORE GR-78
- Compatible Products:
- Rework Flux: TACFlux® 020B, TACFlux® 089HF
- Cored Wire: CW-802, CW-807
- Wave Flux: WF-7745, WF-9945
Alloys
Indium Corporation manufactures low-oxide spherical powder composed of a variety of Pb-free alloys that cover a broad range of melting temperatures. Type 3 and Type 4 powders are standard offerings with SAC305 and SAC387 alloys. The metal percent is the weight percent of the solder powder in the solder paste and is dependent upon the powder type and application. Standard product offerings are detailed in the following table
SKU | G100991 |
---|---|
Mfg. Part Number | 8.9E |
Brand | Indium |
Material | SAC305 |
Type | No Clean |
Notes | Lead-Free |