Indium 8.9HFRV

SAC305 Lead-Free, Halogen-Free No-Clean Solder Paste

Lead-Free

Indium8.9HFRV is an air reflow, no-clean solder formulated to accommodate the higher processing temperatures required by SnAgCu, SnAgCuSb, and other alloy systems favored by the electronics industry to replace conventional Pb-bearing solders. Indium8.9HFRV features exceptional low-voiding performance. In addition, Indium8.9HFRV provides excellent stencil print transfer efficiency and response-to-pause performance.

Grouped product items
Product Name	Qty
Indium PASTEOT-803128-500G SAC305 Lead-Free, Halogen-Free No-Clean 89% T4 Solder Paste, 500g Jar $149.41
Indium PASTEOT-803128-600G SAC305 Lead-Free, Halogen-Free No-Clean 89% T4 Solder Paste, 600g Cartridge $179.29

Skip to the beginning of the images gallery

Technical Documents

Product Info & TDS Sheets

Indium 8.9HFRV Solder Paste Technical Data Sheet

Details

Features

Formulated for low voiding when used with high-reliability alloys
Halogen-free
High transfer efficiency through small apertures (≤0.66AR)
Excellent wetting
Excellent response-to-pause performance
Compatible with both Air and N₂ reflow environments
Storage Conditions (unopened containers): <10°C
Shelf Life: 6 months
Compatible Products
- Rework Flux: TACFlux® 089HF, TACFlux® 020B-RC

Alloys

Indium Corporation manufactures low-oxide spherical powder composed of a variety of Pb-free alloys that cover a broad range of melting temperatures. This document covers Type 4 powder as a standard offering for high-reliability alloys. The metal percent is the weight percent of the solder powder in the solder paste and is dependent upon the powder type and application.

More Information