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SAC305 Lead-Free No-Clean Solder Paste
Indium8.9 is an air or nitrogen reflow, no-clean solder paste specifically formulated to accommodate the higher processing temperatures required by SnAgCu, SnAg, and other alloy systems favored by the electronics industry to replace Pb-bearing solders. Indium8.9 offers excellent stencil print transfer efficiency to work in the broadest range of processes. In addition, the superior soldering performance under high temperatures and long reflow processes provides exceptional head-in-pillow performance.
- High transfer efficiency through small apertures (≤0.66 AR)
- Excellent wetting to all common finishes at high and low peak reflow temperatures
- Eliminates head-in-pillow defects
- High oxidation resistance
Features
- Type: Lead-Free 8.9 No-Clean Solder Paste Type 3 Metal Load: 88.50% (800449)
- Type: Lead-Free 8.9 No-Clean Solder Paste Type 4 Metal Load: 88.25% (800420)
- Shelf Life: 6 months
- Alloy: SAC305 (Sn96.5Ag3Cu0.5) TYPE: No-Clean
- Storage Conditions: <10°C (unopened containers)
- Flux Type (per J-STD-004A), ROL1, J-STD-005 (IPC-TM-650), BELLCORE GR-78
- Compatible Products:
- Rework Flux: TACFlux® 020B, TACFlux® 089
- Cored Wire: CW-807
- Wave Flux: WF-7742, WF-9942
Alloys
Indium Corporation manufactures low-oxide spherical powder composed of a variety of Pb-free alloys that cover a broad range of melting temperatures. Type 3 and Type 4 powder are standard offerings with SAC alloys. The metal percent is the weight percent of the solder powder in the solder paste and is dependent upon the powder type and application. Standard product offerings are detailed below.
SKU | G100992 |
---|---|
Mfg. Part Number | 8.9 |
Brand | Indium |
Material | SAC305 |
Type | No Clean |
Notes | Lead-Free |