Indium 10.1

SAC305 Lead-Free No-Clean Solder Paste

Lead-Free

Indium10.1 is an air or nitrogen reflow, no-clean solder paste specifically formulated to accommodate the higher processing temperatures required by SnAgCu and other Pb-free alloy systems favored by the electronics industry to replace Pb-bearing solders. Indium10.1 offers exceptional stencil print transfer efficiency to work in the broadest range of processes. In addition, the high oxidation resistance of Indium10.1 virtually eliminates incomplete coalescence (graping) of small deposits and the head-in-pillow defect. Indium10.1 also offers extremely low, large ground-plane voiding found in QFN components.

Low-voiding on QFN, BGA, and CSP components
Exceptional head-in-pillow resistance
High transfer efficiency and low variation through small apertures (≤0.66 AR)
Eliminates the graping phenomenon
Outstanding RF shield metallization wetting

Grouped product items
Product Name	Qty
Indium 801065-500G SAC305 Lead-Free No-Clean 88.5% T4 Solder Paste, 500g Jar $150.96
Indium 801065-600G SAC305 Lead-Free No-Clean 88.5% T4 Solder Paste, 600g Cartridge $181.15

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Technical Documents

Product Info & TDS Sheets

Indium10.1 Lead-Free Solder Paste Technical Data Sheet

Details

Features

Type: Lead-Free 10.1 No-Clean Solder Paste Type 4 Metal Load: 88.50% (801065)
Shelf Life: 12 months
Alloy: SAC305 (Sn96.5Ag3Cu0.5) TYPE: No-Clean
Storage Conditions: <10°C (unopened containers)
J-Standard-004B, Flux Classification: ROL1, Conforms with all requirements from J-STD-005A
Compatible Products:
- Rework Flux: TACFlux® 089HF
- Cored Wire: CW-807
- Wave Flux: WF-9945, WF-9958

Alloys

Indium Corporation manufactures low-oxide spherical powder composed of a variety of Pb-free alloys that cover a broad range of melting temperatures. This document covers Type 4 and Type 3 powders as standard offerings with SAC alloys. The metal percent is the weight percent of the solder powder in the solder paste and is dependent upon the powder type and application.

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