Package Conversion Adapters
SOIC to DIP
Designed to convert rectangular type, 0.050" (1.27mm) pitch SOIC devices for soldering or socketing in a dual in-line (DIP or DIL) application.
QFP Adapters
Convert BGA, LGA, or other device packages to an existing QFP to QFP with the same or different footprint. Available in 0.50mm to 1.27mm pitch.
PLCC to PGA
Adapts JEDEC 0.050" (1.27mm) pitch PLCC packages (Leaded Type A) to standard PGA footprints. Polarization pin option available.
Peel-A-Way® Removable Carriers
Standard strips are available in single, dual, and triple row designs on 1.27mm, 2.0mm or 2.54mm pitch. Standard configurations from 2 to 100 positions per row.
Test Pins & Terminal Jacks
Hundreds of standard and custom designs available for SMT and thru-hole applications. New spring pin designs are available on a custom basis.