Platinum Cure Dual Component Potting Silicone Encapsulant

Typical Applications

• Protecting and electrically isolating electronic components

Notes

• Manufactured in Japan
• This product uses a very reliable and established formula
• It has a low viscosity that helps to fill all voids
• Easy to degas
• Has a slower 8-hour working time if used at room temperature

Typical Properties

• Type: Potting Encapsulant
• Cure Type: Addition
• One/Two Component: Two
• UL: Y
• Low Molecular Weight Siloxane Stripped?: Y
• Color: Reddish Brown
• Density @ 23°C (g/cm³): 1.54
• Viscosity A (cps): 6,000
• Mix Ratio by weight: 100:100
• Cure Conditions: 15min @100°C
• Working Time: 8 Hours
• Shore A Hardness: 70
• Tensile Strength (MPa): 3.50
• % Elongation: 90
• Volume Resistivity (TΩ·m): 2.0
• Dielectric Strength (kV/mm): 27
• Dielectric Constant: 3.2 @ 50Hz
• Dielectric Dissipation Factor: 1x10^-3 @ 50Hz
• Thermal Conductivity (W/m·K): 0.30
• Usable Temperature Range: -40°C to +200°C

Note: Values are not for specification purposes.