Heat Transfer Silicone Compound
860 is a thermal paste designed to reduce thermal resistance between irregular metal surfaces. Coupled with reasonable thermal conductivity, it has a soft consistency and a wide operating temperature range, making it an ideal thermal paste for CPU applications. This silicone-based thermal paste is mostly used to improve heat flow between heat sinks and heat-generating components, such as CPUs, GPUs, LEDs, motors, and power components.
- High dielectric strength
- Excellent corrosion resistance
- Non-bleeding heat transfer paste
- Non-electrically conductive
- Long service life
| PAC Item Code | C100329 |
|---|---|
| Mfg. Part Number | 860 |
| Brand | MG Chemicals |
Properties
- Color: White
- Filler: Zinc oxide
- Base Material: Silicone oil
- Density: 2.4 g/mL
- Viscosity: 490 Pa∙s
- Resistivity: 1.5 x 1015Ω·cm
- Thermal Conductivity @ 25°C: 0.7 W/(m·K)
- Evaporation Loss, 22 h @ 165°C: 0.1 %
- Oil Separation, 30 h @ 165°C: 0.7 %
- Worked Penetration, 1/2 scale: 303
- Water Washout @ 38°C, Bearing Dried @ 77°C: 0.1%
- Dielectric Strength: 400 V/mil
- Dielectric Constant: 3.8
- Dissipation Factor: 0.003
- Service Temperature Range: -40 - 200°C
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