Electronic Dual-Component Epoxy Potting & Encapsulating Compound
832HD is a black, rigid, 2-part epoxy that provides extreme environmental, mechanical and physical protection for printed circuit boards and electronic assemblies. Due to its low mixed viscosity, 832HD can easily penetrate small gaps and cavities. It also provides excellent electrical insulation and protects components from static discharge, vibration, abrasion, thermal shock, environmental humidity, salt water, fungus, and many harsh chemicals.
- Low mixed viscosity of 4,100 cP
- Extremely high compressive and tensile strength
- Excellent adhesion to a wide variety of substrates including metals, composites, glass, ceramics, and many plastics
- Excellent electrical insulating characteristics
- Extreme resistance to water and humidity
- Solvent-free
| PAC Item Code | C100325 |
|---|---|
| Mfg. Part Number | 832HD |
| Brand | MG Chemicals |
Cured Properties
- Resistivity: 1.4 x 1013Ω·cm
- Breakdown Voltage: 41,700 V
- Dielectric Strength: 400 V/mil
- Dissipation Factor @ 1 MHz: 0.04
- Dielectric Constant @ 1 MHz: 2.5
- Hardness: 80 D
- Tensile Strength: 32 N/mm2
- Compressive Strength: 75 N/mm2
- Lap Shear:
- Stainless Steel: 21 N/mm2
- Aluminum: 14 N/mm2
- Glass Transition Temperature (Tg): 41°C
- CTE Prior Tg: 73 ppm/°C
- CTE After Tg: 207 ppm/°C
- Thermal Conductivity @ 25°C: 0.3 W/(m·K)
- Service Temperature Range: -40 - 150°C
- Intermittent Temperature: -50 - 175°C
Usage Parameters
- Working Time: 45 min
- Mix Ratio by Volume: 1:1
- Mix Ratio by Weight: 1.22:1
Uncured Properties
- Mixed Density: 1.0 g/mL
- Density:
- A: 1.1 g/mL
- B: 1.0 g/mL
- Viscosity @ 25°C:
- A: 5.9 Pa·s
- B: 2.3 Pa·s
- Mixed: 4.1 Pa·s
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