Tgon™ 800 Series Graphite Based Electrically Conductive Gap Filler
Used where electrical isolation is not required, Tgon™ 800 is ideal for where electrical contact and thermal transfer are desired. Its unique grain-oriented, plate-like structure provides a high thermal conductivity of 240 W/mK in the XY plane and 5 W/mK through the z-axis. Tgon™ 800 can be supplied in 12" x 18" (305mm x 457mm) or 18" x 24" (457mm x 610mm) sheets, rolls, or die-cut to specific configurations. It is also available with proprietary pressure-sensitive adhesive on one side. This adhesive coating is the thinnest available, minimizing any impact on thermal performance.
- High thermal conductivity of 5 W/mK in Z axis and 240 W/mK in the X-Y axis
- >98% graphite
- Low thermal resistance
Capabilities
Automated Packaging | Automated Pad Placement | Custom Automation | Custom Product Development | Modeling | Prototyping | Service | Testing
Industries
Aerospace/Defense | Automotive
Applications
Automotive Lighting | LED Lighting | Notebooks/Tablets/Portable Devices | Power Converters | Power Supplies
Typical Properties
- Color: Pewter
- Density (g/cc): 2.20
- Operating Temperature Max (Celsius): 300
- Operating Temperature Min (Celsius): -240
- Outgassing CVCM (%): 0.090
- Outgassing TML (%): 0.150
- Shelf Life:
- 2 years from the date of Shipment
- 1 year from the date of shipment with adhesive
Thermal Properties
- Thermal Conductivity (W/mK): 5.00
- Thermal Resistance @10 psi Max (C-in2/W): 0.692
- Thermal Resistance @10 psi Min (C-in2/W): 0.250
- Thermal Resistance @30 psi Max (C-in2/W): 0.340
- Thermal Resistance @30 psi Min (C-in2/W): 0.175
- Thermal Resistance @50 psi Max (C-in2/W): 0.270
- Thermal Resistance @50 psi Min (C-in2/W): 0.155
Mechanical Properties
- Hardness (Shore 00): 85
Dimensions
- Thickness Max (inches): 0.020
- Thickness Max (mm): 0.51
- Thickness Min (inches): 0.005
- Thickness Min (mm): 0.13
Compliance
- ROHS Compliant: Yes
- UL Flammability Rating: V-0
| SKU | G101027 |
|---|---|
| Brand | Laird |
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