Tflex™ HD81000 Thermal Gap Filler, 0.04" Thick, 9" x 9" Sheet
Tflex™ HD80000 is the latest product in the High Deflection gap filler series. Tflex™ HD80000 combines 6 W/mK thermal conductivity with superior pressure versus deflection characteristics. The combination will allow minimal stress on components while also yielding low thermal resistance. As a result, less mechanical and thermal stresses will be experienced within your device.
The Tflex™ HD80000 material is extremely soft, but also can be handled and applied manually without the need to add a fiberglass or other reinforcement layer, maintaining the superior thermal performance of the product.
Features
- 6 W/mK thermal conductivity
- Low pressure versus deflection
- Excellent surface wetting for low contact resistance
- No fiberglass reinforcement
- Minimizes board and component stress
- Environmentally friendly solution that meets regulatory requirements including RoHS and REACH
- Buy 10 for $80.05
- Buy 50 for $70.26
Capabilities
Automated Packaging | Automated Pad Placement | Custom Automation | Custom Product Development | Modeling | Prototyping | Service | Testing
Industries
Aerospace/Defense | Automotive | Consumer | Industrial | Telecom/Datacom
Applications
Automotive ADAS | Automotive Electronics | Automotive Infotainment | Automotive Powertrain/ECUs | Drones/Satellites | Gaming Systems | Instrumentation | Notebooks/Tablets/Portable Devices | Routers | Smart Home Devices | Wireless infrastructure | Solid State Drive
Specifications
- Construction & Composition: Ceramic filled silicone sheet
- Color: Teal
- Thermal Conductivity (W/mK): 6.0
- Density (g/cc): 3.3
- Hardness (Shore 00, 3 sec): 40
- Hardness (Shore 00, 30 sec): 32
- Outgassing TML (weight %): 0.3
- Outgassing CVCM (weight %): 0.04
- Temperature Range: -65-150°C
- Rth@ 50 mils, 10 psi: 0.330°C-in2/W
- Dielectric Constant @ 1 MHz: 9
- UL Flammability Rating: V-0
- Volume Resistivity: 1.06 x 1016 Ohm-cm
SKU | I362470 |
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Mfg. Part Number | A17883-04 |
Brand | Laird |