Tflex™ SF820 Thermal Gap Filler, 0.02" Thick, 9" x 9" Sheet
Tflex™ SF800 is a high-performance, compliant, silicone free thermal interface material. By coupling extremely high thermal conductivity with exceptional wetting characteristics, Tflex™ SF800 provides some of the lowest thermal resistance values in the industry. This makes it well suited for applications where silicone based pads are traditionally used as well as those applications which are silicone sensitive.
Tflex™ SF800 is naturally tacky on both sides requiring no additional adhesive coating, which would inhibit thermal performance. The natural tack allows for the pad to be held in place during assembly.
Features
- Silicone-free gap filler
- Thermal Conductivity of 7.8 W/mK
- Exceptionally low thermal resistance
- Environmentally friendly solution that meets regulatory requirements including RoHS and REACH
- Buy 10 for $56.03
- Buy 50 for $49.18
Technical Documents
Capabilities
Automated Packaging | Automated Pad Placement | Custom Automation | Custom Product Development | Modeling | Prototyping | Service | Testing
Industries
Aerospace/Defense | Automotive | Consumer | Industrial | Telecom/Datacom
Applications
Automotive ADAS | Automotive Electronics | Automotive Infotainment | Automotive Powertrain/ECUs | Drones/Satellites | Gaming Systems | Instrumentation | Notebooks/Tablets/Portable Devices | Routers | Smart Home Devices | Wireless infrastructure | Solid State Drive
Specifications
- Construction & Composition: Ceramic filled silicone free sheet
- Color: Grey
- Thermal Conductivity (W/mK): 7.8
- Density (g/cc): 3.1
- Hardness Shore 00: 81
- Temperature Range: -25-120°C
- Rth@ 40 mils, 10 psi: 0.237°C-in2/W
- Dielectric Constant @ 1 MHz: 16
- UL Flammability Rating: V-0
- Volume Resistivity: 5 x 1012 Ohm-cm
| SKU | I362447 |
|---|---|
| Mfg. Part Number | A15754-02 |
| Brand | Laird |
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