C13-3150 Underfill Epoxy
Key Features
- Low temperature thermal cure underfill
- Low Viscosity due to no filler
- Fast Cure at Low Temperatures
- Excellent adhesion and Drop Shock performance
- Anhydride Free
- NON-REWORKABLE
ALPHA HiTech CU13-3150 is a one-component, low temperature thermal cure capillary underfill designed for lower temperature applications for thermally sensitive parts. ALPHA HiTech CU13-3150 does not contain any fillers. Its low viscosity property is excellent for BGA application, thus no preheat is required during the dispensing process.
SKU | G100646 |
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Mfg. Part Number | C13-3150 |
Brand | ALPHA HiTech |
Type | Underfill |