Indium 8.9HFA

SAC305 Lead-Free, Halogen-Free No-Clean Solder Paste

Lead-Free

Indium8.9HFA is an air reflow, no-clean solder paste specifically formulated to accommodate the higher processing temperatures required by SnAgCu, SnAg, and other alloy systems favored by the electronics industry to replace conventional Pb-bearing solders. Indium8.9HFA offers unprecedented stencil print transfer efficiency to work in the broadest range of processes.

Eliminates clogged apertures through advanced rheology
High speed printing (>100mm/second capable)
Eliminates hot and cold slump
Excellent wetting
High oxidation resistance
Halogen-free per EN14582 test method

Grouped product items
Product Name	Qty
Indium 800693-500G SAC305 Lead-Free, Halogen-Free No-Clean 88% T4 Solder Paste, 500g Jar $150.96
Indium 800693-600G SAC305 Lead-Free, Halogen-Free No-Clean 88% T4 Solder Paste, 600g Cartridge $181.15
Indium 800714-500G SAC305 Lead-Free, Halogen-Free No-Clean 88.5% T3 Solder Paste, 500g Jar $144.10
Indium 800714-600G SAC305 Lead-Free, Halogen-Free No-Clean 88.5% T3 Solder Paste, 600g Cartridge $172.92

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Technical Documents

Product Info & TDS Sheets

Indium8.9HFA Lead-Free Solder Paste Technical Data Sheet

Details

Features

Type: Lead-Free 8.9HFA No-Clean Halogen-Free Solder Paste Type 3 Metal Load: 88.50% (800714)
Type: Lead-Free 8.9HFA No-Clean Halogen-Free Solder Paste Type 4 Metal Load: 88.00% (800693)
Shelf Life: 6 months
Alloy: SAC305 (Sn96.5Ag3Cu0.5) TYPE: No-Clean
Storage Conditions: <10°C (unopened containers)
J-Standard-004B, Flux Classification: ROL0, Conforms with all requirements from J-STD-005A
Compatible Products:
- Rework Flux: TACFlux® 020B-RC, TACFlux® 089HF
- Cored Wire: CW-807, Core 230-RC
- Wave Flux: WF-9945, WF-9958

Alloys

Indium Corporation manufactures low-oxide spherical powder composed of a variety of Pb-free alloys that cover a broad range of melting temperatures. This document covers Types 3 and 4 powder as standard offerings with SAC alloys. Other alloys may be available upon request. The metal percent is the weight percent of the solder powder in the solder paste and is dependent upon the powder type and application. Standard product offerings are detailed in the following table

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