SAC305 Lead-Free, Halogen-Free No-Clean Solder Paste
Indium8.9HF1 is an air reflow, no-clean solder paste. Indium8.9HF1 offers unprecedented stencil print transfer efficiency to work in the broadest range of processes. In addition, the high probe testability of Indium8.9HF1
minimizes false failures in ICT.
- High oxidation barrier to eliminate graping and HIP defects
- Highly probe-testable flux residue
- Halogen-free per EN14582 test method
- Excellent print transfer efficiency on 0.4mm pitch CSPs
Features
- Type: Lead-Free 8.9HF1 No-Clean Halogen-Free Solder Paste Type 3 Metal Load: 88.50% (800595)
- Type: Lead-Free 8.9HF1 No-Clean Halogen-Free Solder Paste Type 4 Metal Load: 88.25% (800596)
- Shelf Life: 6 months
- Alloy: SAC305 (Sn96.5Ag3Cu0.5) TYPE: No-Clean
- Storage Conditions: <10°C (unopened containers)
- J-Standard-004B, Flux Classification: ROL0
- Compatible Products:
- Rework Flux: TACFlux® 020B-RC, TACFlux® 089HF
- Cored Wire: CW-807
- Wave Flux: WF-9945, WF-9958
Alloys
Indium Corporation manufactures low-oxide spherical powder composed of a variety of Pb-free alloys that cover a broad range of melting temperatures. This document covers Type 3 and Type 4 powder as standard offerings with SAC alloys. The metal percent is the weight percent of the solder powder in the solder paste and is dependent upon the powder type and application. Standard product offerings are detailed in the following table.
SKU | G100994 |
---|---|
Mfg. Part Number | 8.9HF1 |
Brand | Indium |
Material | SAC305 |
Type | No Clean |
Notes | Halogen-Free, Lead-Free |