SAC305 Lead-Free Water Soluble Solder Paste

Indium3.2 is an air or nitrogen reflow, water-soluble solder paste specifically formulated to accommodate the higher processing temperatures required by the SnAgCu, SnAg, SnSb, and other Pb-free alloy systems. This product formulation offers consistent, repeatable printing performance combined with a long stencil life and sufficient tack strength to handle the challenges of today's high-speed as well as high-mix surface mount lines. In addition
to consistent printing and reflow requirements, this solder paste offers superb wetting to the various Pb-free metallizations and has exceptional low-voiding performance on fine-pitch components, including BGAs and CSPs.

• Consistent fine-pitch printing performance with high transfer efficiency from stencil apertures
• Superior fine-pitch soldering ability
• Wide reflow profile window
• Excellent response-to-pause printing performance
• Outstanding slump resistance
• Low-voiding
• Minimal foaming during the cleaning process
• Excellent wetting