AIM Solder

SAC305 Lead-Free M8 No-Clean Solder Paste

Lead-Free

Low voiding on BGA and BTC components
REACH and RoHS compliant
For use with demanding, high density electronic assemblies
High SIR/Electrically safe residue
Formulated for use with T4 and finer powders
Mitigates head-in-pillow

Grouped product items
Product Name	Qty
AIM Solder A-M8305J5-3A 88.5% SAC305 Lead-Free M8 No-Clean Solder Paste, Type 3, 500g Jar (Case of 10) $1,750.00
AIM Solder A-M8305J5-4C 88.5% SAC305 Lead-Free M8 No-Clean Solder Paste, Type 4, 500g Jar (Case of 10) $1,500.00
AIM Solder A-M8305C6-4A 88.5% SAC305 Lead-Free M8 No-Clean Solder Paste, Type 4, 600g Cartridge In Stock $121.65

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Technical Documents

Product Info & TDS Sheets

AIM M8 Solder Paste Technical Data Sheet

SDS/MSDS Sheets

AIM SAC305 M8 Solder Paste Safety Data Sheet

Details

M8 no clean solder paste is designed for the most demanding high density electronic assemblies. An evolution of the highly successful NC258 platform, M8 brings no clean solder paste to the next level.

Developed in combination with T4 and finer mesh leaded and lead-free alloy powders, M8 provides stable transfer efficiencies required for today's challenging applications. A novel activator system provides powerful, durable wetting action accommodating a wide range of profiling processes and techniques. M8 eliminates HiP defects on BGA and reduced voiding on QFN/BTC components while producing bright shiny solder joints.

M8 leaves minimal, high purity, residue, engineered to be safely left in place. Developed with the input of coating and cleaning industry partners, residues can be directly coated or easily removed.

More Information